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A High-Performance LC Wireless Passive Pressure Sensor Fabricated Using Low-Temperature Co-Fired Ceramic (LTCC) Technology

机译：采用低温共烧陶瓷（LTCC）技术制造的高性能LC无线无源压力传感器

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Chen Li; Qiulin Tan; Chenyang Xue; Wendong Zhang; Yunzhi Li; Jijun Xiong;
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年度 2014
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1. A High-Performance LC Wireless Passive Pressure Sensor Fabricated Using Low-Temperature Co-Fired Ceramic (LTCC) Technology [J] . Chen Li, Chenyang Xue, Jijun Xiong, Sensors . 2014,第12期

机译：采用低温共烧陶瓷（LTCC）技术制造的高性能LC无线无源压力传感器
2. Passive wireless pressure sensor fabricated in low-temperature co-fired ceramic technology [J] . Mingliang Yang, Wei Liu, Jijun Xiong, Proceedings of the institution of mechanical engineers . 2015,第N4期

机译：采用低温共烧陶瓷技术制造的无源无线压力传感器
3. Microfabrication of a Novel Ceramic Pressure Sensor with High Sensitivity Based on Low-Temperature Co-Fired Ceramic (LTCC) Technology [J] . Chen Li, Chenyang Xue, Jijun Xiong, Micromachines . 2014,第2期

机译：基于低温共烧陶瓷（LTCC）技术的新型高灵敏度陶瓷压力传感器的微细加工
4. Low-Temperature Co-fired Ceramic (LTCC) Technology for Development of Sensors for Emerging Applications [C] . H. Birol, S. Lopera, G. Farine, International symposium on microelectronics . 2013

机译：低温共烧陶瓷（LTCC）技术，用于新兴应用的传感器开发
5. Non-contact critical dimension metrology sensor for chrome photomasks implemented using a low-temperature co-fired ceramic technology. [D] . Guillaume, Nadine Marie-Pierre. 2002

机译：用于铬光掩模的非接触式临界尺寸计量传感器，采用低温共烧陶瓷技术实现。
6. A High-Performance LC Wireless Passive Pressure Sensor Fabricated Using Low-Temperature Co-Fired Ceramic (LTCC) Technology [O] . Chen Li, Qiulin Tan, Chenyang Xue, 2014

机译：采用低温共烧陶瓷（LTCC）技术制造的高性能LC无线无源压力传感器
7. A High-Performance LC Wireless Passive Pressure Sensor Fabricated Using Low-Temperature Co-Fired Ceramic (LTCC) Technology [O] . Chen Li, Qiulin Tan, Chenyang Xue, 2014

机译：采用低温共烧陶瓷（LTCC）技术制造的高性能LC无线无源压力传感器
8. Analysis of the Pull Strength Behaviors of Fine-Pitch, Flip Chip Solder Interconnections Using a Au-Pt-Pd Thick Film Conductor on Low-Temperature, Co-Fired Ceramic (LTCC) Substrates [R] . Vianco, P. T., Rejent, J. A., Grazier, J. M., 2008

机译：利用au-pt-pd厚膜导体在低温共烧陶瓷（LTCC）基板上分析细间距，倒装芯片焊料互连的拉伸强度行为

A High-Performance LC Wireless Passive Pressure Sensor Fabricated Using Low-Temperature Co-Fired Ceramic (LTCC) Technology

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